Preparation of copper films with developed surface morphology and microcrystalline structure at high current densities
https://doi.org/10.34680/2076-8052.2023.3(132).357-364
Abstract
The results of studies of surface morphology and composition of copper coatings obtained by electrodeposition at high current densities are presented. It is shown that the copper deposits have a pyramidal growth of crystals with the formation of crystalline aggregates with distinct edges. Thus, the crystals were characterized by a homogeneous form over the entire surface area of the samples. Increasing the current density and, accordingly, overvoltage leads to an increase of the number of crystal nuclei, that causes formation of large crystalline aggregates due to the fusion of neighboring crystals. Electrodeposition conditions at high current densities make it possible to control the values of electrochemical and diffusion factors as well as the mechanism of nucleation and growth of copper crystals. The results obtained indicate that by varying the conditions of electrolysis, it is possible to obtain copper deposits with a specific microcrystalline structure.
About the Authors
E. N. Muratova
Saint Petersburg Electrotechnical University "LETI"
Russian Federation
Russian Federation
Saint Petersburg
I. A. Vrublevsky
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Minsk
A. K. Tuchkovsky
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Minsk
N. V. Lushpa
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Minsk
O. A. Kovaleva
Belarusian State University of Informatics and Radioelectronics
Belarus
Belarus
Minsk
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Review
For citations:
Muratova E.N., Vrublevsky I.A., Tuchkovsky A.K., Lushpa N.V., Kovaleva O.A. Preparation of copper films with developed surface morphology and microcrystalline structure at high current densities. Title in english. 2023;(3(132)):357-364. (In Russ.) https://doi.org/10.34680/2076-8052.2023.3(132).357-364
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